CAS No.: 102-60-3
EDTP N,N,N'N'-tetra(2-hydropropyl)ethylene Diamine is soluble in water easily, and the aqueous solution showes alkaline.
CAS No.: 96-53-7
H1 2-mercapto Thiazoline is used as main component of additive for acid copper plating.Good brightness and level result can be obtained.
CAS No.: 17636-10-1
MPS Sodium 3-mercaptopropanesulphonate is used to prepare brightener for copper plating, especially for the plating of printed circuit boards.
CAS No.: 21668-81-5
UPS 3-S-Isothiuronium Propyl Sulfonate can also be used in other acidic plating bath, other precious metals such as acidic silver plating and palladium plating.
N Ethylenethiourea is a brightener for copper plating, excellent results can be obtained by adding a very small amount of the brightener.
CAS No.: 27206-35-5
SPS Bis(3-sodiosulfopropyl) Persulfide can be used in combination with typical copper plating formulations such as nonionic surfactants, polyamines and other hydrogen sulfide compounds.
